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EPT
5 小时
Emerging trends, key markets in 2.5D and 3D semiconductor packaging
Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system ...
EPT
22 小时
Holy cow! Cattle Scan milks a winner at HardTech
Eight leading-edge Canadian technology firms lined up to pitch their ground-breaking ideas front of a panel of judges as part ...
EPT
1 天
Feds deliver $7M to APMA for Project Arrow expansion
Automotive collaboration supports talent development and training to demonstrate Canadian automotive ingenuity ...
EPT
1 天
ventureLAB signs MOU with Hudson Valley FastFab
ventureLAB, a leading global founder community for hardware technology and enterprise software companies in Canada, and ...
EPT
2 天
Sager and Advanced Energy to speed power supply delivery
Advanced Energy, a global provider of power conversion, measurement and control solutions, has announced a joint initiative ...
EPT
2 天
Global chip sales hit highest-ever monthly total in September
“The global semiconductor market continued to grow during the third quarter of 2024, with quarter-to-quarter sales increasing ...
EPT
3 天
Angled M5 panel mount compact connectors serve tight spaces
BINDER M5 panel mount connectors are engineered for applications requiring compact, durable solutions in fields like ...
EPT
3 天
SIA commends selections for CHIPS R&D flagship facilities
Facilities include NY CREATES’s Albany NanoTech Complex and administrative headquarters for the NSTC in Sunnyvale CA ...
EPT
4 天
electronica 2024 to deliver strong supporting program
Representing the largest trade show focused on electronics engineering, electronica has created an international platform ...
EPT
4 天
Tiny footprint sensor fits presence detection, facial recognition, always-on
OMNIVISION OV0TA1B monochrome (mono)/infrared (IR) CMOS image sensor fits 3mm module Y dimension and smaller notebook computers, webcams and IoT devices. The low-power device is suitable for ...
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