This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these ...

A chip packaging technique in which the active area ... any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel ...

One way to segment the packaging landscape is by interconnect type, which includes wirebond, flip-chip, wafer-level packaging (WLP), and through-silicon vias (TSVs). Some 75% to 80% of packages are ...

TAIPEI (Taiwan News) — A cross-research team supported by the National Science and Technology Council (NSTC) has developed a ...

The global semiconductor & IC packaging materials market size is calculated at USD 44 billion in 2024 and is expected to ...

Flip Chip Technology Flip Chip is the method of electrically connecting the die to the package carrier. The package carrier provides the connection from the die to the exterior of the package. In ...

Surfx's Dr. Robert Hicks takes us on a journey of discovery around plasma, and the potential it has to revolutionize the ...

Sixteen Hikvision LED displays have been awarded Green Product Mark certification by TÜV Rheinland – making them the first ...

Hangzhou Hikvision Digital Technology Co., Ltd. ("Hikvision") announced that 16 of its LED display products received the ...

ASE Technology Holding Co (日月光投控), the world’s largest IC packaging and testing services provider, held a groundbreaking ...

Although named after the semiconductor packaging technique we are familiar with today, DEC Flip-Chips were introduced in 1964 as a modular electronics packaging system. These were used in many of ...