DuPont has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category. The award recognizes DuPont’s development of polishing pads for advanced semiconductor ...
For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...
Gary Patton, chief technology officer at GlobalFoundries, sat down with Semiconductor Engineering to talk about new materials, stacked die, how far FD-SOI can be extended, and new directions for ...