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康宁获芯片法案资助玻璃基项目&TSV在C
康宁获芯片法案资助玻璃基项目&TSV在CPO封装突破,关注龙头沃格光电:rocket:事件:康宁公司将根据《CHIPS 和科学法案》获得 3200 万美元的资助。在周五的公告中,美国商务部表示,拟议的资金将帮助康宁提高芯片制造过程中使用的玻璃产品的产量,新闻稿中指出这两种玻璃用于GKJ和光掩膜,凸显了玻璃基重要性。
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