Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer and the inauguration ...

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system ...

The Ministry of Environment said on Tuesday that bottled spring water contains, on average, 1.32 pieces of microplastics per ...

A breakthrough discovery in indium selenide could revolutionize memory storage technology by enabling crystalline-to-glass ...

Edifier, who have owned Japanese electrostatic audio company STAX since 2011, recently released their latest wireless ...

Using a custom-built machine to launch microprojectiles at supersonic speeds, Cornell researchers have uncovered new details ...

Infineon Technologies AG has progressed in its development of what it claims is the first 300 mm gallium nitride (GaN) power ...

"We can see changes long before … any other technique, which might only detect changes at the micrometer scale," Sokolov added in the lab report. Material degradation is another key piece of ...

The shapes of simple polyatomic molecules such as carbon dioxide and methane are characterized by a specific symmetry ...

The thinness of silicon wafers is important because it reduces resistance and power loss. Current-gen wafers measure 40 to 60 ...

Researchers have developed tiny, wireless devices capable of wrapping around individual neurons, potentially aiding in the ...