This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these ...

The global semiconductor & IC packaging materials market size is calculated at USD 44 billion in 2024 and is expected to ...

Surfx's Dr. Robert Hicks takes us on a journey of discovery around plasma, and the potential it has to revolutionize the ...

Flip chip (FC; also called invert welding) is a new type of micro‐assembly technology. In recent years, flip chip has become a frequently used packaging format in the field of high‐end devices, ...

High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market. Two 8-nozzle heads with compact design enable ...

Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.

TAIPEI (Taiwan News) — A cross-research team supported by the National Science and Technology Council (NSTC) has developed a ...

ASE Technology Holding Co (日月光投控), the world’s largest IC packaging and testing services provider, held a groundbreaking ...