Navitas has released a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAL-7L and TOLL surface-mount ...

Chiplet designs demand versatile interconnect solutions that minimize die-to-die latency and support a variety of packaging ...

D and 3D packaging improve system bandwidth and power efficiency by increasing I/O routing density and reducing I/O bump size ...

A wideband RF power amplifier module from Elite RF covers signals from 20 MHz to 6 GHz, delivering a maximum output power of ...

KAGA FEI’s WKI611AA1 Wi-Fi 6 and Bluetooth 5.4 combo module simplifies the development of low-power embedded devices.

A design idea that uses brute force to mitigate of PWM Vdd and ground voltage deviations to improve PWM performance.

The InfiniiVision HD series oscilloscopes from Keysight employ a 14-bit ADC, offering four times the vertical resolution of ...

Enhancing Part 1’s pulse generator to produce a square wave output with well-shaped edges as well as pulses and continuous sine Continue Reading ...

This power tip discusses a low-cost, highly accurate e-meter that uses a single current sensor for e-metering and PFC current ...

Chiplet designs demand versatile interconnect solutions that minimize die-to-die latency and support a variety of packaging Continue Reading ...

The AI-assisted component selection tool accelerates design process by connecting developers with suppliers in an automated ...

The challenges that come with powering outdoor PoE cameras and the importance of using weatherproofed midspans and switches.