This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these ...

TAIPEI (Taiwan News) — A cross-research team supported by the National Science and Technology Council (NSTC) has developed a ...

A chip packaging technique in which the active area ... any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel ...

Although named after the semiconductor packaging technique we are familiar with today, DEC Flip-Chips were introduced in 1964 as a modular electronics packaging system. These were used in many of ...

Surfx's Dr. Robert Hicks takes us on a journey of discovery around plasma, and the potential it has to revolutionize the ...

In addition, we have assembled the components using the flip-chip packaging and assembly processes. We have also developed a passive optical connector consisting of a moulded plastic lens assembly ...

The global semiconductor & IC packaging materials market size is calculated at USD 44 billion in 2024 and is expected to ...

One way to segment the packaging landscape is by interconnect type, which includes wirebond, flip-chip, wafer-level packaging (WLP), and through-silicon vias (TSVs). Some 75% to 80% of packages are ...

Sixteen Hikvision LED displays have been awarded Green Product Mark certification by TÜV Rheinland – making them the first ...

Description: magazine handler Fluid dispensers Epoxy daub/stamp tools Air bearing table Steady state or pulse heat stages Flip chip (90°-180°) Features Double-pick process protected under US Patent ...

Hangzhou Hikvision Digital Technology Co., Ltd. ("Hikvision") announced that 16 of its LED display products received the ...