The pedagogical model of the integrated circuit goes something like this ... Samsung’s V-NAND [image source] While the idea of 3D chips constructed out of multiple layers of silicon is an ...

Griffith, J. Robins, G. Salowe, J.S. and Tongtong Zhang 1994. Closing the gap: near-optimal Steiner trees in polynomial time. IEEE Transactions on Computer-Aided ...

Researchers at the Hong Kong Polytechnic University and other institutes in China recently developed a new intrinsically ...

Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures” was published by researchers at University of ...

Kageshima, Performance analysis of 3D-IC for multi-core processors in sub- 65nm CMOS technologies, Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on, 2010, pp.

Faraday, a leading application specific integrated circuits (ASIC) design service and IP provider, supports customers with chip design projects. Recently, Faraday announced a 2.5D/3D-IC advanced ...

TAIPEI (Taiwan News) — Taiwan’s integrated circuit (IC) output is expected to grow by 22% to NT$5.3 trillion (US$165 billion) ...

PhotonDelta, the European hub for photonics, will launch a worldwide competition for new applications for photonics chips at PIC Summit 2024 (Eindhoven 15 October). Partners include imec, LioniX ...

The partnership aims to streamline design workflows and boost productivity by analyzing 3D integrated circuits (IC), photonic, electromagnetic (EM) and radio frequency (RF). 3D-IC design involves ...

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, ...

Our method can be used to inform better design of metrology for dielectric materials for 3D integrated circuit technologies.” Find the technical paper here. (Note, there is a local download option.).