Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures” was published by researchers at University of ...

Nomura, K. Abe, S. Fujita, Y. Kurosawa and A. Kageshima, Performance analysis of 3D-IC for multi-core processors in sub- 65nm CMOS technologies, Circuits and Systems (ISCAS), Proceedings of 2010 IEEE ...

PhotonDelta, the European hub for photonics, will launch a worldwide competition for new applications for photonics chips at PIC Summit 2024 (Eindhoven 15 October). Partners include imec, LioniX ...

TAIPEI (Taiwan News) — Taiwan’s integrated circuit (IC) output is expected to grow by 22% to NT$5.3 trillion (US$165 billion) ...

Griffith, J. Robins, G. Salowe, J.S. and Tongtong Zhang 1994. Closing the gap: near-optimal Steiner trees in polynomial time. IEEE Transactions on Computer-Aided ...

“We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave ...

Voinigescu, Sorin P. Tomkins, Alexander Dacquay, Eric Chevalier, Pascal Hasch, Juergen Chantre, Alain and Sautreuil, Bernard 2013. A Study of SiGe HBT Signal Sources in the 220–330-GHz Range. IEEE ...

Faraday, a leading application specific integrated circuits (ASIC) design service and IP provider, supports customers with chip design projects. Recently, Faraday announced a 2.5D/3D-IC advanced ...

Siemens and TSMC have also collaborated on the definition and testing of Calibre 3DThermal software, which is Siemens’ newest thermal analysis solution for verification and debugging of advanced 3D ...

Siemens and TSMC have also collaborated on the definition and testing of Calibre 3DThermal software, which is Siemens’ newest thermal analysis solution for verification and debugging of advanced 3D ...

Faraday Technology to utilize ANSS' cutting-edge simulation tools to develop advanced designs for 2.5D/3D-ICs.

and high-speed data communication semiconductors Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs ...